AUTOMATIC MACHINE

Products Blog

Solder Wire Extrusion Machine(250T、350T、 450T)


Extrudes tin alloy solder into ¢9 mm, ¢12 mm, ¢15 mm solder wires, flux content 2.5%±0.1%.  

Solder Bar Machine(Casting-Type)


Heats tin alloy solder to 300-400°C, casts into 0.5 kg or 1.0 kg bars.  

Tin Smelting Furnace


Melts leaded and lead-free solder products, including tin-based alloys.

Lead-Tin Separation Crystallizer


Separates lead-tin alloys with >80% tin, achieving 99.98% tin purity.  

UP.K Machinery Jiangmen City Co., Ltd. Showcases Technical Strength at the 2023 Electronic Solder Materials Summit


The 2023 Electronic Solder Materials Summit, hosted by the Electronic Solder Materials Branch of the China Electronic Materials Industry Association, successfully concluded in Jiangmen.

UP.K Machinery Jiangmen City Co., Ltd. Secures Industry Recognition at the 2023 Electronic Solder Materials Summit


Warm Congratulations to Our Company for Receiving a Prestigious Honor from the Electronic Solder Materials Branch of the China Electronic Materials Industry Association in 2023

The 2025 Indonesia Mining Conference & Key Metals Meeting has successfully concluded!


UP.K Machinery Jiangmen City Co., Ltd. Impressively Showcases at the 2025 Indonesia Mining & Critical Metals Conference, Supporting the Smart Upgrade of Key Metal Extraction

Rolling Mills Receive More Orders in Metal Surface Processing


Recently, various metal fabrication companies have adopted new-generation rolling mills to improve material thickness uniformity.

Tin Bar Production Shifts Toward Energy Efficiency and Automation


Fully automatic tin bar machines are gaining importance in the new materials industry. With increasing interest in energy-saving production, companies are developing heating units with higher thermal efficiency to reduce energy consumption.

Tin Semi-Sphere Forming Technology Expands in Precision Electronics


Fully automatic tin semi-sphere machines have recently been implemented by several manufacturers, gaining attention for their forming consistency in electronic packaging applications.